Transparent hafnium indium zinc oxide thin-film transistors adopting single- and double-etch-stopper layers were evaluated. Compared to devices with a single $hbox{SiO}_{x}$ etch stopper (ES) grown at 150 $^{circ}hbox{C}$, a double ES with a second $hbox{SiO}_{x}$ film grown at 350 $^{circ}hbox{C}$ provides a superior device performance such as improved subthreshold swing, threshold voltage, field effect mobility, and higher stability under a negative bias stress. The stretched-exponential analyses of the bias stress results indicate that the denser high-temperature $hbox{SiO}_{x}$ protects more effectively the underlying semiconductor during the source/drain etch process and suppresses the generation of defect states therein.
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