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Experimental study of a micro-rotor fabricated on a silicon wafer

机译:在硅晶圆上制造的微型转子的实验研究

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This paper describes an experimental study of the fabrication of micro-mechanisms on a silicon wafer. Planar process technology developed in the industry of CMOS LSI was employed. The structural material is CVD-polycrystalline silicon with a thickness of 2.5 μm and the sacrificial material is CVD-SiO2with a thickness of 1.0 μm. In the experimental study, micro-rotors with a shaft and a cap in an assembled form were fabricated on a silicon wafer. The self-alignment process gave a tolerance of 1.0 μm between the rotor and the shaft. The maximum rotation speed observed was 9 x 104rpm by blowing nitrogen gas.
机译:本文描述了在硅晶圆上制造微机制的实验研究。采用了CMOS LSI行业开发的平面工艺技术。结构材料为CVD-多晶硅,厚度为2.5 μm,牺牲材料为CVD-SiO2,厚度为1.0 μm。在实验研究中,在硅晶圆上制造了带有轴和组装形式的盖子的微型转子。自对准过程在转子和轴之间给出了 1.0 μm 的公差。通过吹氮气观察到的最大转速为 9 x 104rpm。

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