Fully Embedded Compact Diplexer into Organic Package Substrate for Dual-Mode (GSM/DCS) Handset Applications

摘要

In this paper, a fully embedded compact diplexer has been designed, fabricated, and characterized for small size and low cost dual-mode (GSM/DCS) handset applications. The diplexer is fully embedded into an organic packaging substrate and remarkably reduced in size and volume by using high Q embedded circular spiral inductors and high dielectric MIM (metal-insulator-metal) capacitors. The fabricated diplexer has insertion losses and isolations of max. - 0.5 dB and min. - 35 dB at 880-960 MHz and max. -0.9dB and min. -22dB at 1710-1880 MHz, respectively. The fabricated diplexer is the smallest one of the diplexers formed onto organic substrate. It has 3.4 X 4.7 X 0.77 mm~3 in volume.