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Fabrication and Properties of Metal-PZT-Metal Capacitors by Liquid Delivery MOCVD

机译:液体输送MOCVD法制备金属-PZT金属电容器的性能

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Pb(Zr_(1-x),Ti_x)O_3(PZT) thin films were prepared on 8-inch and 4-inch Pt or Ir-electroded Si wafers by liquid delivery metal-organic chemical vapor deposition (LD-MOCVD) using cocktail sources of Pb, Zr and Ti. The processing conditions were optimized in order to obtain high-performance PZT films. The thickness uniformity of PZT films on 8-inch substrate was about ±3.24%. The deposition rate of Pb (15.8 nm/min) and Ti (17.9 nm/min) deposited on Si substrate were faster than that of Zr (2.5 nm/min). The growth temperature of PZT film was adjusted to 570-630 deg C depending on the substrates used. The properties of metal/PZT/metal capacitors were also studied. The PZT films based on Pt substrate showed no good ferroelectric properties. By contrast, the ferroelectric properties of Ir/IrO_2/PZT/IrO_2/Ir capacitors were excellent. At an applied voltage of 5 V, the remanent polarization (P_r) and coercive field (E_c) values were about 36 mu C/cm2 and 50 kV/cm, respectively.
机译:通过使用鸡尾酒混合液进行金属有机化学气相沉积(LD-MOCVD)在8英寸和4英寸Pt或Ir电镀的Si晶片上制备Pb(Zr_(1-x),Ti_x)O_3(PZT)薄膜铅,锆和钛的来源为了获得高性能的PZT膜,对处理条件进行了优化。 8英寸基板上PZT膜的厚度均匀性约为±3.24%。在Si衬底上沉积的Pb(15.8 nm / min)和Ti(17.9 nm / min)的沉积速率比Zr(2.5 nm / min)更快。根据所使用的基材,将PZT膜的生长温度调节至570-630℃。还研究了金属/ PZT /金属电容器的性能。基于Pt衬底的PZT薄膜没有良好的铁电性能。相反,Ir / IrO_2 / PZT / IrO_2 / Ir电容器的铁电性能优异。在5 V的施加电压下,剩余极化(P_r)和矫顽场(E_c)值分别约为36μC / cm2和50 kV / cm。

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