Non-Contact 10 Efficient 36mW Power Delivery Using On-Chip Inductor in 0.18-μm CMOS

摘要

This paper presents design and implementation of an inductive coupling power delivery system between stacked chips in 0.18-μm CMOS process. Two conventional high-power rectifier structures are compared, and a new topology is proposed. With a pair of fully optimized 700μm×700μm on-chip inductors, the test chip achieves 10 peak efficiency and 36mW power transmission. Compared with previous published chip-to-chip wireless power transmission systems, the received power is 13 times larger.