Efficient precision machining of the smallest bores 0.015 to 4 mm in diameter

摘要

Product miniaturisation is continuing not only in the electronics, analytical, automotive, telecommunications and medical sectors, but also in machine building. The market for and the overall economic importance of micro technology are developing dynamically and will continue to grow substantially in the future. This can be seen at all levels where value is added in the micro technology industry [1]. To 'miniaturise' successfully, often it is not enough simply to make everything smaller. For example, the choice of materials has to be reassessed, because in micro technology the chip-removal machining of ductile materials is extremely critical, since for most applications even the smallest burrs and plastic deformation cannot be tolerated [2]. This is also why the use of tungsten carbide, ceramic, silicon and polycrystalline diamond (PCD) is becoming increasingly more important. Also, it is not always possible to scale down conventional machining methods with the accompanying machines and tools to the micrometer range, which in many cases means that the machining system has to be changed. Brittle-hard materials are machined predominantly by grinding and polishing, using diamond as the abrasive. In micro technology, the machining of a bore presents a particular challenge. This is mainly due to the fact that access to the machining surface is difficult and also what are often large aspect ratios (the length of the bore in relation to the diameter).