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Dimensional stability improvement of kenaf panels by post-manufacturing hygrothermal treatments using response surface methodology

机译:使用响应面方法的制造后湿热处理提高洋麻板的尺寸稳定性

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摘要

The potential of various hygrothermal post manufacturing treatments is evaluated in this study to determine the suitable heat treatment and moisture conditions for relieving the internal residual stresses and improving the dimensional stability characteristics of medium density and high density kenaf fiber-boards (MDF and HDF, respectively), generally known to have poor dimensional stability. Furthermore, the effects of these conditions on the density and mechanical properties of the panels have been evaluated. The treatment involves conditioning at normal (65% relative humidity, RH) or high humidity (85% RI-I) and then heat treating these panels at different combinations of temperature and time. The results are statistically analyzed by using response surface method of Design Expert software. The desirability function is employed to find the treatment conditions that give suitable dimensional stability with minimum compromise on the mechanical properties of the panels. Within the range of experimental conditions, the parameters with maximum desirability are 225 degrees C, 30 min, 85% RH and 200 degrees C, 90 min, 85% RH for MDF and HDF panels, respectively. The panels treated under these conditions result in approximately 25-30% reduction in thickness swelling without any significant reduction in their mechanical properties with respect to those of the non- treated panels. However, with more intensive treatment, the thickness swelling within the limits of experimental study can be decreased by approximately 35%. Although some mechanical properties of the panels are compromised under these conditions, they are still above the requirements of ANSI A208.2-2009 and ANSI A135.4-2012 standards. (C) 2015 Elsevier B.V. All rights reserved.
机译:本研究评估了各种湿热后处理的潜力,以确定合适的热处理和水分条件,以减轻内部残余应力并改善中密度和高密度洋麻纤维板(分别为MDF和HDF)的尺寸稳定性),通常已知尺寸稳定性差。此外,已经评估了这些条件对板的密度和机械性能的影响。该处理涉及在正常(65%相对湿度,RH)或高湿度(85%RI-1)下调节,然后在不同的温度和时间组合下对这些面板进行热处理。使用Design Expert软件的响应面方法对结果进行统计分析。使用期望函数来找到能够提供合适的尺寸稳定性而对面板的机械性能的损害最小的处理条件。在实验条件范围内,MDF和HDF面板的最大期望参数分别为225摄氏度,30分钟,85%RH和200摄氏度,90分钟,85%RH。在这些条件下处理的面板相对于未处理的面板,其厚度溶胀降低了约25-30%,而其机械性能没有任何明显的降低。但是,通过更深入的处理,在实验研究范围内的厚度溶胀可以降低约35%。尽管在这些条件下会损害面板的某些机械性能,但仍高于ANSI A208.2-2009和ANSI A135.4-2012标准的要求。 (C)2015 Elsevier B.V.保留所有权利。

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