Transient Submodeling Analysis for Board-Level Drop Tests of Electronic Packages

摘要

We present in this paper a submodeling analysis procedure capable of solving transient mechanical responses of board-level electronic packages subjected to drop impact loads, involving large deformations and nonlinear elastoplastic constitutive relationships for the solder alloy. This paper is focused on the verification of this submodeling analysis procedure and to investigate solution deviations caused by several abbreviated global models that involve simplified geometry or material properties for the solder joints