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首页> 外文期刊>British Corrosion Journal >Effects of inorganic sulphide and ammonia on microbial corrosion behaviour of 70Cu-30Ni alloy in sea water
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Effects of inorganic sulphide and ammonia on microbial corrosion behaviour of 70Cu-30Ni alloy in sea water

机译:无机硫化物和氨对70Cu-30Ni合金在海水中微生物腐蚀行为的影响

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摘要

A laboratory electrochemical investigation was carried out on the effects of inorganic sulphide (1 ppm) and ammonia (10 ppm), as sea water pollutants, on the corrosion of 70Cu-30Ni alloy owing to sulphate reducing bacteria (SRB). Potential-time and linear polarisation measurements revealed that the presence of SRB makes the corrosion potential more active by ~250 mV and increases the corrosion rate by a factor of ~6.5. The addition of inorganic sulphide to sea water inoculated with SRB caused a significant ennoblement of the corrosion potential which was associated with a decrease in the corrosion rate, while the addition of ammonia did not affect the corrosion potential although it caused a significant increase in the corrosion rate. Sulphate reducing bacteria had a pronounced effect on the potentiodynamic polarisation through shifting the corrosion potential to a more active value and eliminating the active-passive transition. However the active-passive transition peak was retained when sulphide was added to sea water inoculated with the bacteria. In the presence of ammonia, the hysteresis loop was retained in the absence of a well defined active-passive transition. With increase in the exposure time to sea water inoculated with SRB, the impedance and phase angle peak decreased. In the presence of sulphide, the impedance increased in the high frequency region and the frequency dependence of the phase angle showed two time constants. In the presence of ammonia, the impedance behaviour experienced significant changes in terms of a decrease in impedance and a shift in the phase angle peak towards lower frequencies. Scanning electron microscopy (SEM) examinations revealed the formation of a patchy layer of bacterial biofilm and corrosion products during exposure to SRB containing sea water. The formation of this layer was associated with depletion of nickel from the alloy. In the presence of inorganic sulphide, micropits and intergranular attack were seen within crevices in an adherent corrosion product layer. In the presence of ammonia, the alloy initially suffered from shallow localised attack which gradually spread to cover the whole metal surface, revealing grain boundaries, twin boundaries, and slip steps.
机译:进行了实验室电化学研究,研究了作为海水污染物的无机硫化物(1 ppm)和氨(10 ppm)对由于硫酸盐还原细菌(SRB)引起的70Cu-30Ni合金腐蚀的影响。电位时间和线性极化测量结果表明,SRB的存在使腐蚀电位的活性提高了约250 mV,腐蚀速率提高了约6.5倍。向接种了SRB的海水中添加无机硫化物会引起腐蚀电位的显着增高,这与腐蚀速率的降低有关,而氨水的加入虽然会引起腐蚀的显着增加,但不会影响腐蚀电位。率。降低硫酸盐含量的细菌通过将腐蚀电位转移到更活跃的值并消除了主动-被动过渡,对电位动力学极化产生了显着影响。但是,当向细菌接种的海水中添加硫化物时,会保留主动-被动过渡峰。在存在氨的情况下,磁滞回线在没有明确定义的主动-被动过渡的情况下得以保留。随着接种SRB的海水暴露时间的增加,阻抗和相角峰值减小。在存在硫化物的情况下,阻抗在高频区域增加,并且相角的频率依赖性显示出两个时间常数。在存在氨的情况下,就阻抗的降低和相角峰值向低频的移动而言,阻抗行为发生了显着变化。扫描电子显微镜(SEM)检查显示,暴露于含有SRB的海水期间,细菌生物膜和腐蚀产物的斑点层形成了。该层的形成与合金中镍的消耗有关。在存在无机硫化物的情况下,在粘附的腐蚀产物层的缝隙中发现了微坑和晶间腐蚀。在存在氨的情况下,合金最初遭受浅的局部腐蚀,然后逐渐扩散以覆盖整个金属表面,从而暴露出晶界,孪晶界和滑移台阶。

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