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Effect of phosphate ions on electrochemical behaviour of copper in sulphate solutions

机译:磷酸根离子对硫酸铜溶液中铜电化学行为的影响

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The effect of phosphate ions on the corrosion behaviour of copper in sulphate solutions was investigated at different temperatures (293, 313, 333 and 353 K) and at different Ph values (Ph = 2.1, 7.2, and 12.3). A three electrode electrochemical technique was used for the measurements, using a saturated calomel electrode (SCE) for reference purposes. Both anodic and cathodic polarisation curves were established, from which the anodic and cathodic Tafel constants were determined. Corrosion potentials were determined by extrapolation of the anodic and cathodic Tafel lines to the point of zero current density. The results showed that for a pH value of 2.1, the corrosion rate of copper showed a marked tendency to increase with increasing temperature in solutions containing either sulphate alone or sulphate plus phosphate. However, at pH values of 7.2 and 12.3, this tendency became less pronounced in solutions containing sulphate alone and in solutions containing sulphate plus phosphate together, maximum corrosion rates were greatly reduced and showed less tendency to increase with increasing temperature. Anodic and cathodic reaction mechanisms are proposed to explain the observations for the corrosion of copper.
机译:在不同温度(293、313、333和353 K)和不同pH值(Ph = 2.1、7.2和12.3)下研究了磷酸根离子对铜在硫酸盐溶液中腐蚀行为的影响。三电极电化学技术用于测量,使用饱和甘汞电极(SCE)作为参考。建立了阳极和阴极极化曲线,由此确定了阳极和阴极的塔菲尔常数。通过将阳极和阴极Tafel线外推到零电流密度的点来确定腐蚀电位。结果表明,在pH值为2.1的情况下,在仅包含硫酸盐或硫酸盐加磷酸盐的溶液中,铜的腐蚀速率显示出随温度升高而明显增加的趋势。但是,在pH值为7.2和12.3的情况下,这种趋势在仅包含硫酸盐的溶液中以及在同时包含硫酸盐和磷酸盐的溶液中变得不那么明显,最大腐蚀速率大大降低,并且显示出随温度升高而增加的趋势较小。提出了阳极和阴极反应机理来解释对铜腐蚀的观察结果。

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