Thermally conductive gap filler

摘要

Dow (Midland, Michigan) has introduced DOWSIL TC-4535 CV, a thermally conductive gap filler. The two-part heat-cure silicone is a thermally conductive adhesive with a low bond line thickness. Dow states that this compound is a soft and compressible material once cured. The compound is designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink, providing a reliable cooling solution for modules like an engine or transmission control unit.