In situ curing and bonding of epoxy prepregs in epoxy thermoset injection molding

摘要

In this study, epoxy molding compounds are combined with fast-curing epoxy prepregs in thermoset injection molding using a new integrative process. The combination is carried out under the varied parameters of mold temperatures and curing times, which are dominant factors in thermoset processing. The focus of the investigations is the bond strength in the interface resulting from these parameters, as the interface is known as the weak point of hybrid components. To identify causes for possible increases and decreases of the bond strength, additional rheological and thermoanalytical analyses are done under near-process conditions. The influence of prepreg pre-crosslinking, a function of the mold temperature, is also described by means of additional tests in which specific pre-crosslinking of the prepreg is adjusted by the temperature storage and then functionalized in integrative process combination. The aim of the study is to identify and understand initial process limits for the integrative process combination for a potential process window.