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Effect of Mg addition on the creep and yield behavior of an Al-Sc alloy

机译:Mg添加量对Al-Sc合金蠕变和屈服行为的影响

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The relationships between microstructure and strength were studied at room temperature and 300 ℃ in an Al-2 wt% Mg-0.2 wt% Sc alloy, containing Mg in solid-solution and Al_3Sc (Ll_2 structure) as nanosize precipitates. At room temperature, the yield strength is controlled by the superposition of solid-solution and precipitation strengthening. At 300 ℃ and at large applied stresses, the creep strength, which is characterized by a stress exponent of ~5, is significantly improved compared to binary Al-Sc alloys, and is independent of the size of the Al_3Sc precipitates. At small applied stress, a threshold stress exists, increasing from 9% to 70% of the Orowan stress with increasing Al_3Sc precipitate radius from 2 to 25 nm. An existing model based on a climb-controlled bypass mechanism is in semi-quantitative agreement with the precipitate radius dependence of the threshold stress. The model is, however, only valid for coherent precipitates, and the Al_3Sc precipitates lose coherency for radii larger than 11 nm. For semi-coherent precipitates with radii greater than 15 nm, the threshold stress remains high, most likely because of the presence of interfacial misfit dislocations.
机译:在室温和300 °C下,以Mg为固溶体,Al_3Sc(Ll_2结构)为纳米级析出物,研究了Al-2 wt% Mg-0.2 wt% Sc合金的显微组织与强度的关系。在室温下,屈服强度由固溶体和沉淀强化的叠加控制。在300 °C和较大的外加应力下,与二元Al-Sc合金相比,蠕变强度显著提高,其特征是应力指数为~5,并且与Al_3Sc析出物的大小无关。在较小的外加应力下,存在阈值应力,随着沉淀半径从2 nm增加到25 nm Al_3Sc从Orowan应力的9%增加到70%。基于爬升控制旁路机制的现有模型与阈值应力的析出半径依赖性存在半定量一致性。然而,该模型仅对相干沉淀物有效,并且Al_3Sc沉淀物在半径大于 11 nm 时会失去相干性。对于半径大于 15 nm 的半相干析出物,阈值应力仍然很高,这很可能是由于存在界面错配位错。

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