Book Review: Assembly and reliability of lead-free solder joints. Springer. (2020)

摘要

Assembly and Reliability of Lead-Free Solder Joints, by John. H, Lau and Ning-Cheng Lee presents good technical insights of assembly packaging and lead-free solder joint reliability theories and applications, which is suitable for both industry engineering and academic practitioners. The authors provide technical insights on the broad values and engineering applications of assembly packaging and lead-free solder joint reliability in this book. While the book is written as a standard technical reference textbook, it contains enough real-world references to highlight the book's practicality, including real-world examples on lead-free solder joint reliability technologies, design for reliability of solder joints, and failure analysis of solder joints at the end of the book. The book's opening chapter presents a good understanding and underscores the fundamentals of solder joints in printed circuits board (PCB) assembly and semiconductor packaging, supporting it with examples of different solder joints in PCB and plated through hole (PTH) assemblies and semiconductor packaging. Solder joints reliability in flip-chip packaging, fan-in and fan-out wafer-level packaging as well as solder joints on package-on-package (PoP) are discussed in Chapter 1. Also contained in the next subsequent focus encompasses a few descriptions of the solder joints in 2D IC integration, 2.5D IC integration and the most recent 3D IC integration. Other semiconductor applications such as micro-electromechanical system (MEMS), CMOS image sensors (CIS), light-emitting diode (LED) and even with high-performance computing (HPC) are highlighted on its solder joint reliabilities and performances.