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Implementation of a compact, four-stage, scalable optical interconnect for photonic backplane applications

机译:为光子背板应用实现紧凑的四级可扩展光学互连

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We report on the implementation of a dense 512-beam free-space optical interconnect linking four optoelectronic VLSI chips at the backplane level. The system presented maximizes the positioning tolerances of the components by use of slow f-number (f/16) Gaussian beams and oversized apertures. A beam-clustering scheme whereby a 4 X 4 array of beams is transmitted by each minilens is used to provide a high channel density. A modular approach is used to decrease the number of degrees of freedom in the system and achieve passive alignment of the modules in the final integration phase. A design overview as well as assembly and experimental results are presented. (C) 2002 Optical Society of America. [References: 18]
机译:我们报告了一个密集的512束自由空间光学互连的实现,该互连在背板上连接了四个光电VLSI芯片。提出的系统通过使用慢f数(f / 16)高斯光束和超大孔径来最大化组件的定位公差。光束聚束方案通过每个微型透镜透射4 X 4的光束阵列来提供高通道密度。模块化方法用于减少系统中的自由度数量,并在最终集成阶段实现模块的被动对齐。介绍了设计概述以及组装和实验结果。 (C)2002年美国眼镜学会。 [参考:18]

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