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首页> 外文期刊>Archives of Metallurgy and Materials >EFFECTS OF DIRECT CURRENT FIELD ON POWDER-PACKED BORIDING PROCESS ON MARTENSITIC STAINLESS STEEL AISI 420
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EFFECTS OF DIRECT CURRENT FIELD ON POWDER-PACKED BORIDING PROCESS ON MARTENSITIC STAINLESS STEEL AISI 420

机译:直接电流场对马氏体不锈钢AISI 420粉末包装成型过程的影响

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摘要

The effects of direct current field on a powder-packed bonding process on a martensitic stainless steel AISI 420 have been investigated at a temperature of 900 °C for about 2-6 hr. A powder-packed bonding process without direct current field (conventional powder-packed boriding process, PB) is a reference as compared to the powder-packed bonding process with applied current densities (PB-DC) of 60-170 mA/cm~2. The microstructure and the presence of boride layers of PB and PB-DC were characterized using optical microscope and X-ray diffraction (XRD). The hardness values of the boride layer were measured by Vickers microhardness tester. Experimental results show that the direct current filed can enhance the decomposition and chemical reaction in the boriding agent and also drive active free boron ions as well as atoms to diffuse toward the cathode. Therefore, a boron concentration around the specimen at the cathode of PB-DC is higher than that at the anode as well as PB (as a reference). As a consequence, higher boride layer thickness of PB-DC was detected. The double-phase boride layer (FeB and Fe_2B) on borided martensitic stainless steel AISI 420 was found both PB and PB-DC. The hardness of the boride layer of about 1800-2000 HV can be observed.
机译:研究了直流磁场对马氏体不锈钢AISI 420的粉末填充粘结过程的影响,该过程在900°C的温度下进行了约2-6小时。与施加电流密度(PB-DC)为60-170 mA / cm〜2的粉末包装粘合工艺相比,无直流场的粉末包装粘合工艺(常规粉末包装硼化工艺,PB)是参考。使用光学显微镜和X射线衍射(XRD)表征了PB和PB-DC的微观结构和硼化物层的存在。硼化物层的硬度值通过维氏显微硬度计测量。实验结果表明,直流电可以促进硼化剂中的分解和化学反应,还可以驱动活性自由硼离子以及原子向阴极扩散。因此,PB-DC阴极处样品周围的硼浓度高于阳极和PB处的硼浓度(作为参考)。结果,检测到更高的PB-DC的硼化物层厚度。发现硼化马氏体不锈钢AISI 420上的双相硼化物层(FeB和Fe_2B)均为PB和PB-DC。可以观察到约1800-2000HV的硼化物层的硬度。

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