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Fabrication of thermally conductive and electrically insulating polymer composites with isotropic thermal conductivity by constructing a three-dimensional interconnected network

机译:制造的导热和电绝缘聚合物复合材料构建一个各向同性热导率三维互连网络

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摘要

Efficient heat removal via thermal management materials has become one of the most critical challenges in the development of modern microelectronic devices. However, the conventional polymer-based thermally conductive composites with randomly distributed filler particles usually yield an undesired value because of the lack of efficient heat transfer pathways. Therefore, constructing a three-dimensional interconnected filler structure is greatly desirable for realizing high thermal conductivity enhancement in composites. Herein, graphene oxide (GO) was used as a thermally conductive filler due to its excellent thermal conductivity and coated with polydopamine (PDA) to enhance its electric insulation performance. A unique "particle-constructing" method was adopted for fabricating highly ordered three-dimensional GO-based polymer composites, throughout which the GO-PDA formed an intact, uniform and well-defined network structure. The composite, even with a very low GO-PDA loading of 0.96 vol%, exhibited both high in-plane (4.13 W m(-1) K-1) and through-plane (4.56 W m(-1) K-1) thermal conductivities and also presented excellent electrically insulating properties (>10(14) omega cm). These composites have promising applications in heat dissipation of next-generation portable and collapsible electronic devices.
机译:通过热管理有效的排热材料已经成为最重要的之一现代发展的挑战微电子设备。传统的聚合物基导热与随机分布复合材料填料通常粒子产生一个不受欢迎的价值由于缺乏高效的传热通路。三维互连填料结构非常理想的实现高热在复合材料导电性增强。石墨烯氧化物(去)用作热导电填料由于其优秀的热导电性和涂有polydopamine (PDA)以增强其电气绝缘性能。采用独特的“particle-constructing”方法制造高度有序三维GO-based聚合物复合材料,在其中GO-PDA形成一个完整的、统一的和明确的网络结构。非常低的GO-PDA装载0.96卷%,展出高平面(4.13 W m (1) k - 1)穿过平面(4.56 W m (1) k - 1)热导率)和优秀电绝缘性能(> 10ω(14)厘米)。新一代便携式的散热和可折叠的电子设备。

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