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Controlling the electronic and geometric structures of 2D insertions to realize high performance metal/insertion-MoS2 sandwich interfaces

机译:控制电子和几何2 d插入结构实现高性能金属/ insertion-MoS2三明治接口

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摘要

Metal/insertion-MoS2 sandwich interfaces are designed to reduce the Schottky barriers at metal-MoS2 interfaces. The effects of geometric and electronic structures of two-dimensional (2D) insertion materials on the contact properties of metal/insertion-MoS2 interfaces are comparatively studied by first-principles calculations. Regardless of the geometric and electronic structures of 2D insertion materials, Fermi level pinning effects and charge scattering at the metal/insertion-MoS2 interface are weakened due to weak interactions between the insertion and MoS2 layers, no gap states and negligible structural deformations for MoS2 layers. The Schottky barriers at metal/insertion-MoS2 interfaces are induced by three interface dipoles and four potential steps that are determined by the charge transfers and structural deformations of 2D insertion materials. The lower the electron affinities of 2D insertion materials, the more are the electrons lost from the Sc surface, resulting in lower n-type Schottky barriers at Sc/insertion-MoS2 interfaces. The larger the ionization potentials and the thinner the thicknesses of 2D insertion materials, the fewer are the electrons that accumulate at the Pt surface, leading to lower p-type Schottky barriers at Pt/insertion-MoS2 interfaces. All Sc/insertion-MoS2 interfaces exhibited ohmic characters. The Pt/BN-MoS2 interface exhibits the lowest p-type Schottky barrier of 0.52 eV due to the largest ionization potential (similar to 6.88 eV) and the thinnest thickness (single atomic layer thickness) of BN. These results in this work are beneficial to understand and design high performance metal/insertion-MoS2 interfaces through 2D insertion materials.
机译:金属/ insertion-MoS2三明治接口旨在降低肖特基的障碍metal-MoS2接口。和电子结构的二维(2 d)插入材料的接触性能金属/ insertion-MoS2接口比较研究了采用基于计算。无论几何和电子二维结构插入材料、费米能级固定效应和电荷散射金属/ insertion-MoS2接口被削弱插入和弱相互作用州和二硫化钼层,没有差距可以忽略不计对二硫化钼层结构变形。在金属/ insertion-MoS2肖特基障碍接口是由三个界面偶极子和四个由潜在的步骤电荷转移和结构变形2 d插入材料。2 d插入材料的亲和力,从Sc电子失去表面,导致降低n型肖特基壁垒Sc / insertion-MoS2接口。电离势和稀释剂2 d插入材料的厚度,就越少Pt的电子积累吗表面,导致较低的p型肖特基障碍在Pt / insertion-MoS2接口。Sc / insertion-MoS2接口表现出电阻字符。最低0.52 eV由于的p型肖特基势垒最大的电离势(类似于6.88eV)和最薄的厚度(单原子BN层厚度)。工作有利于理解和设计高金属/ insertion-MoS2接口性能通过2 d插入材料。

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