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Fabrication of air-stable n-type carbon nanotube thin-film transistors on flexible substrates using bilayer dielectrics

机译:air-stable n型碳纳米管的制造薄膜晶体管在柔性基板使用双分子层电介质

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摘要

Single-walled carbon nanotube (SWNT) thin-film transistors hold great potential for flexible electronics. However, fabrication of air-stable n-type devices by methods compatible with standard photolithography on flexible substrates is challenging. Here, we demonstrated that by using a bilayer dielectric structure of MgO and atomic layer deposited (ALD) Al2O3 or HfO2, air-stable n-type devices can be obtained. The mechanism for conduction type conversion was elucidated and attributed to the hole depletion in SWNT, the decrease of the trap state density by MgO assimilating adsorbed water molecules in the vicinity of SWNT, and the energy band bending because of the positive fixed charges in the ALD layer. The key advantage of the method is the relatively low temperature (120 or 90 degrees C) required here for the ALD process because we need not employ this step to totally remove the absorbates on the SWNTs. This advantage facilitates the integration of both p-type and n-type transistors through a simple lift off process and compact CMOS inverters were demonstrated. We also demonstrated that the doping of SWNTs in the channel plays a more important role than the Schottky barriers at the metal contacts in carbon nanotube thin-film transistors, unlike the situation in individual SWNT-based transistors.
机译:单壁碳纳米管(碳)薄膜晶体管保持灵活的潜力巨大电子产品。n型设备的兼容的方法标准光刻灵活的基质是具有挑战性的。使用双层介质结构分别以和原子层沉积(ALD)氧化铝或HfO2,air-stable n型设备。传导机制类型转换阐明和归因于孔损耗在碳,减少的陷阱密度状态通过采用吸收吸附水分子碳纳米管的附近,能带弯曲因为积极的固定支出的退化层。相对较低的温度(120或90摄氏度)因为我们需要所需的退化过程不使用这一步完全移除被吸收的物质在纳米管上。促进了p型和集成通过一个简单的发射n型晶体管过程和紧凑的CMOS逆变器演示。掺杂的纳米通道中扮演着更多比肖特基壁垒的重要作用在碳纳米管薄膜金属接触晶体管,与个人的情况SWNT-based晶体管。

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