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首页> 外文期刊>International Journal of Thermal Energy and Applications >Electronics Cooling Study of a CPU Using Forced Convection
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Electronics Cooling Study of a CPU Using Forced Convection

机译:电子冷却CPU使用强迫的研究对流

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In this study, the performance of an air-cooled, flat-plate heat sink in forced convection was calculated using a three-dimensional analytical model. This study investigates the impact of heat sink thermal performance and external variables on the heat sink's thermal stress stability, which is critical for manufacturers' objectives. The influence of various characteristics on the heat transfer rate from the surface of a heat sink was examined. The results showed that convection-radiation heat transfer reduced the temperature by about 65 % of its initial value. To increase the air-cooling performance of plate-fin heat sinks, the slotted fin concept was used. The integral plate fin, discrete plate fin, and discrete slotted fin heat sinks were all subjected to numerical simulations of laminar heat transfer and flow pressure decrease. Discrete plate fin performance is better than integrated continuous plate fin performance at the same fan pumping power, and slotted fin performance is better than discrete plate fin performance. The authors then propose a novel sort of heat sink with discrete and slotted fin surfaces, thinner fins, and fewer intervals between fins. The Preliminary results had shown that a good cooling system with a reasonable convection coefficient of ambient air can result in good performance of the system. The findings and conclusions of this investigation will be presented in a future paper. This Analysis include 3D simulation, Designing of required parts and study on the obtained results.
机译:在这项研究中,气冷式的性能,平板在强制对流散热器使用一个三维的分析计算模型。水槽热力性能和外部变量在散热器的热应力稳定,这对于制造商的目标是至关重要的。各种特征的影响从热表面的传热速率水槽是检查。convection-radiation传热降低了温度大约65%的初始值。增加的空气冷却性能铝制散热片,开缝翅片的概念使用。和离散开缝翅片散热器都是层流进行数值模拟传热和流动的压力减少。离散板翅片性能比综合连续板翅片的性能相同的风扇抽运功率和割缝翅片性能优于离散板翅片的性能。与离散和开缝翅片散热器表面,薄的鳍,和更少的时间间隔鳍之间。一个好的合理的冷却系统会导致环境空气对流系数系统的性能良好。这次调查将会和结论提出了在以后的论文。包括3 d仿真,设计所需的零件和研究结果。

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