首页> 外文期刊>Journal of the European Ceramic Society >Reactive brazing C-f/SiC to itself and to Mo using the NiPdPtAu-Cr filler alloy
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Reactive brazing C-f/SiC to itself and to Mo using the NiPdPtAu-Cr filler alloy

机译:使用Nipdptau-Cr填充合金自身和Mo反应性C-F / SiC

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摘要

The NiPdPtAu-Cr filler alloy was proposed for joining C-f/SiC composites. The wettability on C-f/SiC composite was studied by the sessile drop method at 1200 degrees C for 30 min. Under the brazing condition of 1200 degrees C for 10 min, the C-f/SiC-C-f/SiC joint strength was only 51.7 MPa at room temperature. However, when used a Mo layer, the C-f/SiC-Mo-C-f/SiC joint strength was remarkably increased to 133.2 MPa at room temperature and 149.5 MPa at 900 degrees C, respectively. At the interface between C-f/SiC and Mo, Mo participated in interfacial reactions, with the formation of Cr3C2/Mo2C reaction layers at the C-f/SiC surface. The improvement in the joint strength should be mainly attributed to the formation of MoNiSi. The C-f/SiC-Mo joint strength was 86.9 MPa at room temperature and 73.7 MPa at 900 degrees C, respectively. After 10 cycles of thermal shock test at 900 degrees C the C-f/SiC-Mo joint strength of 71.6 MPa was still maintained. (C) 2017 Elsevier Ltd. All rights reserved.
机译:提出了用于C-f/SiC复合材料连接的NiPdPtAu-Cr填充合金。采用静滴法研究了C-f/SiC复合材料在1200℃下30min的润湿性。在1200℃钎焊10min的条件下,室温下C-f/SiC-C-f/SiC接头强度仅为51.7mpa。然而,当使用Mo层时,C-f/SiC-Mo-C-f/SiC接头强度在室温下显著增加至133.2MPa,在900℃时显著增加至149.5MPa。在C-f/SiC与Mo的界面上,Mo参与了界面反应,在C-f/SiC表面形成Cr3C2/Mo2C反应层。接头强度的提高应主要归功于莫尼西的形成。C-f/SiC-Mo接头在室温下的强度为86.9mpa,在900℃下的强度为73.7mpa。在900℃下进行10次热冲击试验后,C-f/SiC-Mo接头强度仍保持在71.6 MPa。(C) 2017爱思唯尔有限公司版权所有。

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