机译:等温工艺参数对SIMA方法制备的芯片基Al-Cu-Mn-Ti合金半固体微观结构的影响
Harbin Univ Sci &
Technol Sch Mat Sci &
Engn Harbin 150001 Heilongjiang Peoples R China;
Harbin Univ Sci &
Technol Sch Mat Sci &
Engn Harbin 150001 Heilongjiang Peoples R China;
Harbin Univ Sci &
Technol Sch Mat Sci &
Engn Harbin 150001 Heilongjiang Peoples R China;
Harbin Univ Sci &
Technol Sch Mat Sci &
Engn Harbin 150001 Heilongjiang Peoples R China;
Harbin Univ Sci &
Technol Sch Mat Sci &
Engn Harbin 150001 Heilongjiang Peoples R China;
Harbin Univ Sci &
Technol Sch Mat Sci &
Engn Harbin 150001 Heilongjiang Peoples R China;
Semi-solid microstructures; SIMA process; isothermal treatment; chip-based; Al-Cu-Mn-Ti alloy;
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