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Mechanical analysis of adhesive interface between wearable electronics and skin

机译:可穿戴电子产品与皮肤粘合界面的力学分析

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摘要

Because of portability and flexibility, flexible wearable electronic devices will be increasingly used in to-day's human life. In this paper, mechanical analysis of paste process of wearable electronics to skin is carried out, and the skin comfort is judged by mechanical response of skin surface. Theoretical result of interface between flexible electronics and skin when sensors are of different shapes is obtained. Nu-merical calculation is carried out, and effects of geometric and physical parameters on skin stresses are investigated. It is found that for devices with the same width and thickness, the strip shape is more likely to cause skin discomfort than the circular shape. Conclusions in this paper provide theoretical basis for designing wearable electronics.
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