New application head for hot melt adhesives is a fast, compact option

摘要

Robatech says its new jetting head is one of the fastest and most compact application heads on the market for high-precision hot melt adhesive applications. With up to 800 switching cycles per second, the SpeedStar Compact enables very small bead and dot application for particularly demanding and clean gluing applications at high production speeds. Robatech has integrated an automatic stroke adjustment to ensure that the electromechanical jetting head can maintain the precision in adhesive application over the entire service life of approximately 500 million operating cycles.