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首页> 外文期刊>Applied thermal engineering: Design, processes, equipment, economics >Convective heat transfer in a lightweight multifunctional sandwich panel with X-type metallic lattice core
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Convective heat transfer in a lightweight multifunctional sandwich panel with X-type metallic lattice core

机译:具有X型金属晶格芯的轻质多功能夹心板中的对流传热

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HighlightsFluid flow and heat transfer in an X-type lattice cored sandwich panel is presented.Detailed thermo-fluidic comparison with competing metallic lattices is carried out.The present sandwich panel outperforms reference ones for a given pumping power.Detailed heat transfer mechanisms are clarified and quantified.AbstractThe thermo-fluidic characteristics of an ultralightweight X-type lattice cored sandwich panel with simultaneous thermal and mechanical load bearing capabilities are studied both experimentally and numerically. Comparisons with competing sandwich panels with periodic cellular material (PCM) cores are carried out at a similar porosity level. For a given Reynolds number, the highly porous X-lattice cored sandwich panel provides up to 38% higher overall Nusselt number than tetrahedral lattice cored sandwich panel, while exhibits comparable heat transfer performance to Kagome lattice cored sandwich panel. Although brazed joints between the lattice core and the facesheets induce both transverse and longitudinal vortices, limited flow mixing asa result of smooth mainstream in the X-lattice leads to inferior average Nusslet number on both the facesheets and ligaments relative to tetrahedral lattice cored sandwich panel. However, the X-lattice has a 66% higher surface area density than tetrahedral lattice, which acts as the main heat transfer enhancement mechanism. Relative to the reference ones, the X-lattice cored sandwich not only provides an overall Nusselt number up to 77% higher for a given pumping power, but also exhibits evidently lower pressure drop for a given Reynolds number. Therefore, such metallic lattices fabricated using the simple metal sheet folding method are superior for lightweight thermal management systems where a cooling fluid with small specific heat is driven by limited pumping power in a long cooling channel.]]>
机译:<![cdata [ 亮点 X型格子芯夹芯板中的流体流量和传热。 详细的Thermo - 与竞争金属格子进行荧光比较。 < CE:PARA ID =“P0015”View =“全部”>本发明的三明治面板优于给定泵送电源的参考。 详细的传热机制澄清和量化。 抽象 通过实验和数值在实验和数量上使用同时热和机械承载能力的超高级X型格子芯片夹芯板的热流体特性。在类似的孔径水平下进行具有周期性蜂窝材料(PCM)芯的竞争夹层面板的比较。对于给定的雷诺数,高孔X-·格子芯片夹芯板提供高于四面体格子芯夹芯板的总冲突数高达38%,而对Kagome格子芯夹芯板表现出可比的传热性能。虽然格子核心和面部表之间的钎焊接头诱导横向和纵向涡旋,但X晶片中平滑主流的有限流量混合ASA导致面板和韧带上的较差的平均口腔数,相对于四面体格子芯夹层板。然而,X-晶格具有比四面体格子更高的表面积密度高66%,其充当主要传热增强机构。相对于参考文献,X-·格子芯三明治不仅为给定的泵送功率提供高达77%的整体篮板,而且还表现出给定雷诺数的减压降低。因此,使用简单的金属板折叠方法制造的这种金属晶格优于轻质热管理系统,其中通过长冷却通道中的有限泵送电力驱动具有小的微冷热的冷却流体。 ]]>

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