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Interfacial Microstructure Evolution Due to Strain Path Changes in Sliding Contacts

机译:推触头应变路径变化引起的界面微观结构演变

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We performed large-scale molecular dynamics (MD) simulations to study the transient softening stage that has been observed experimentally in sliding interfaces subject to strain path changes. The occurrence of this effect can be of crucial importance for the energy efficiency and wear resistance of systems that experience changes in the sliding direction, such as bearings or gears in wind parks, piston rings in combustion engines, or wheel-rail contacts for portal cranes. We therefore modeled the sliding of a rough counterbody against two polycrystalline substrates of face-centered cubic (fcc) copper and body centered cubic (bcc) iron with initial near-surface grain sizes of 40 nm. The microstructural development of these substrates was monitored and quantified as a function of time, depth, and applied pressure during unidirectional sliding for 7 ns. The results were then compared to the case of sliding in one direction for 5 ns and reversing the sliding direction for an additional 2 ns. We observed the generation of partial dislocations, grain refinement, and rotation as well as twinning (for fcc) in the near-surface region. All microstructures were increasingly affected by these processes when maintaining the sliding direction but recovered to a great extent upon sliding reversal up to applied pressures of 0.4 GPa in the case of fcc Cu and 1.S GPa for bcc Fe. We discuss the applicability and limits of our polycrystalline MD model for reproducing well-known bulk phenomena such as the Bauschinger effect in interfacial processes.
机译:我们进行了大规模的分子动力学(MD)模拟,以研究在经过实验中观察到的滑动界面的瞬态软化阶段进行应变路径变化。这种效果的发生对于经历滑动方向的变化的系统的能效和耐磨性,例如风园中的轴承或齿轮,燃烧发动机的活塞环或门轨起重机的轮轨接触的能量和耐磨性至关重要。因此,我们将粗糙阵线的滑动模型,以防止面向较中心的立方(FCC)铜和机身核心立方(BCC)铁的两个多晶基板,其初始近表面粒度为40nm。在单向滑动期间监测和量化这些基板的微观结构,并定量作为时间,深度和施加压力的函数7 ns。然后将结果与在一个方向上滑动5 ns的情况进行比较,并倒置另外2ns的滑动方向。我们观察了近表面区域中的部分位错,晶粒细化和旋转以及孪生(FCC)的产生。当保持滑动方向时,所有微观结构越来越受到这些过程的影响,但在很大程度上在很大程度上在FCC Cu和1.SCCC Fe的情况下在施加0.4GPa的施加压力时恢复到施加的压力。我们讨论了多晶MD模型的适用性和限制,用于再现众所周知的散装现象,例如Bauschinger效应在界面过程中。

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