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Generation of meso- and microporous structures by pyrolysis of polysiloxane microspheres and by HF etching of SiOC microspheres

机译:通过聚硅氧烷微球的热解和SIOC微球的HF蚀刻产生中间和微孔结构

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摘要

The porosity of polysiloxane microspheres obtained by emulsion processing of variably modified polyhydromethylsiloxane (PHMS) and subjected to pyrolysis in an Ar atmosphere at 450-650 degrees C was studied. Materials having micro- and mesopores with specific surface areas (SSAs) of up to 786 m2/g and pore volumes of up to 0.35 cm(3)/g were obtained. A high porosity was displayed by the microspheres heated at 600 degrees C that underwent deep depolymerization processes. Some polysiloxane microspheres were ceramized at temperatures of 1200-1500 degrees C and were subjected to etching by 35% aqueous HF. The microspheres heated to 1200-1400 degrees C were free of microcracks, whereas those ceramized at 1500 degrees C showed microcracks and macropores, although they preserved their spherical structure well. All of the microspheres ceramized at temperatures of 1200-1400 degrees C had low porosity. HF etching granted high micro- and mesoporosity to the materials ceramized at 1300-1500 degrees C. Microspheres heated at 1500 degrees C showed specific surface areas above 1000 m(2)/g after etching. These micro spheres had low oxygen contents and were mostly composed of silicon carbide. Since they also showed macroporosity, HF etching of the polysiloxane microspheres ceramized at 1500 degrees C could be used to obtain hierarchically mesoporous-macroporous ceramic microspheres.
机译:研究了通过可变改性多羟甲基硅氧烷(PHMS)的乳液加工获得的聚硅氧烷微球的孔隙率,并在450〜650℃下进行热解。获得具有高达786m 2 / g的比表面积(SSA)和高达0.35cm(3)/ g的孔体积的微型和中孔的材料。通过在600℃下加热的微球显示高孔隙率,该微球在深层解聚过程中加热。将一些聚硅氧烷微球在1200-1500℃的温度下陶醉,并经受35%HF水溶液的蚀刻。加热至1200-1400℃的微球体不含微裂纹,而在1500摄氏度下陶醉的那些陶瓷显示微裂纹和大孔,尽管它们保持良好的球形结构。在1200-1400℃的温度下陶醉的所有微球具有低孔隙率。 HF蚀刻在1300-1500摄氏度C.在1500℃下加热的微球授予高的微球和中孔隙率,在蚀刻后,在1500℃下加热的微球显示出高于1000μm(2)/ g的比表面积。这些微型球体具有低氧含量,并且主要由碳化硅组成。由于它们还显示出大孔隙度,因此在1500℃下陶醉的聚硅氧烷微球的HF蚀刻可用于获得分层介孔 - 大孔陶瓷微球。

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