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首页> 外文期刊>Current applied physics: the official journal of the Korean Physical Society >Polycrystalline silicon thin films prepared by Ni silicide induced crystallization and the dopant effects on the crystallization
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Polycrystalline silicon thin films prepared by Ni silicide induced crystallization and the dopant effects on the crystallization

机译:硅化镍诱导晶化的多晶硅薄膜及其掺杂对晶化的影响

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摘要

Intrinsic and doped polycrystalline silicon thin films were grown by the Ni silicide seeds induced crystallization. The Ni first reacted to Si forming a silicide seeds, then these seeds act as nuclei, from which the grains start to grow laterally. Compared with traditional Ni induced lateral crystallization, polycrystalline silicon thin film was grown by Ni silicide induced crystallization with low Ni contamination and large grain sizes. It can be found that the Ni silicide induced crystallization rate is accelerated by p-type doping and is decelerated by n-type doping. And the slightly and strongly phosphorous-doped polycrystalline silicon can be obtained with different grain shapes. Also, the sheet resistance of doped polycrystalline silicon decreases with the increasing of the doping atoms. A reasonable explanation is presented for the dopant effects on the growth rate, microstructure and electronic properties of the samples.
机译:本征和掺杂的多晶硅薄膜是通过硅化镍种子诱导的结晶生长的。 Ni首先与Si反应形成硅化物晶种,然后这些晶种充当核,晶粒从此开始横向生长。与传统的Ni诱导的横向结晶相比,通过Ni硅化物诱导的结晶生长的多晶硅薄膜具有低的Ni污染和大的晶粒尺寸。可以发现,硅化镍诱导的结晶速率通过p型掺杂而加速,而通过n型掺杂而减速。并且可以获得具有不同晶粒形状的轻度和强磷掺杂的多晶硅。而且,掺杂的多晶硅的薄层电阻随着掺杂原子的增加而降低。对于掺杂剂对样品的生长速率,微观结构和电子性能的影响,给出了合理的解释。

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