High Temperature Storage Life Study on Epoxy Molding Compound with Red Phosphorous Flame Retardant for Electronic Devises

摘要

We developed epoxy molding compound with red phosphorous flame retardant system for electronic devises. However, HTSL (High Temperature Storage Life) property of this material was not reported yet. After HTSL treatment, Al/Au bonding pad has crack and is also corroded by chemicals from red phosphorous. It is suggested that H_3PO_3 and H_3PO_4 corrode bonding pad easily and that PH_3 is unrelated by ToF-SIMS (Time of Flight Secondary Ion Mass Spectroscopy) analysis of bonding pad and by formulation studies. Finally, we developed new molding compound with a small quantity of H_3PO_3 and H_3PO_4, and this molding compound shows excellent property regarding HTSL.