Governing Mechanisms of the Joining procedure Without Heating and Pressuring and Effects of Surface Roughness on the Procedure

摘要

Increase of contact area during solid state bonding process is simulated by using a model which is quantitatively available. The dominant mechanisms for the perfect contact are obtained as a function of bonding parameters. The boundary diffusion becomes more dominant at the lower bonding temperature or the lower bonding temperature or the lower bonding pressure. The time required for the perfect contact increases exponentially as the temperature and the pressure decrease. In case of the bonding procedure without heating and pressing, a initial surface roughness is significant for the perfect contact. Since the contact area prepared by such procedure is commonly small, the elastic deformation becomes significant. With the same manner as the theory of contact mechanics, the criterion of the surface roughness for the elastic perfect contact is deduced.