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Gluing Nanoparticles with a Polymer Bonding Layer: The Strength of an Adhesive Bond

机译:用聚合物粘合层粘合纳米颗粒:粘合强度

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The adhesive joint between silica nanoparticles and ultrathin poly(vinylpyridine) (PVP) layers (thickness between 3 and 100 nm) was tested using the cantilever of an atomic force microscope. Specifically, the strength of the adhesive bond (or practical adhesion) was probed in a tearing contact mode, when the particle was removed by applying a tangential force parallel to the substrate surface. The effect of the polymer molecular weight and layer thickness on the particle (practical) adhesion was investigated. It was found that the particles were removed by destroying the cohesive contact zone and that the PVP layer thickness had a pronounced effect on the force needed to destroy the adhesive joint. In particular, the greater the layer thickness, the larger was the required break force. However, the strength of the adhesive joint was estimated to be higher for a thinner layer. It is suggested that mechanical properties of the system as well as molecular characteristics of the PVP layer are responsible for the trend observed. The molecular weight of the polymer did not significantly affect the strength of the adhesive bond.
机译:使用原子力显微镜的悬臂梁测试了二氧化硅纳米颗粒与超薄聚(乙烯基吡啶)(PVP)层(厚度在3至100 nm之间)之间的粘合连接。具体而言,当通过施加平行于基材表面的切向力除去颗粒时,以撕裂接触模式探测粘合剂的强度(或实际粘合)。研究了聚合物分子量和层厚度对颗粒(实用)附着力的影响。已经发现,通过破坏内聚的接触区域可以除去颗粒,并且PVP层的厚度对破坏粘结点所需的力有明显的影响。特别地,层厚度越大,所需的断裂力就越大。然而,对于较薄的层,估计粘合接头的强度较高。建议该系统的机械性能以及PVP层的分子特征是观察到的趋势的原因。聚合物的分子量没有显着影响粘合强度。

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