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首页> 外文期刊>スマートプロセス学会誌 >Kinetics in Solid State Bonding of Superplastic Steel 一 Effect of Geometrical Factors of Surface Asperity on Contacting Modes and Bonding Mechanisms 一
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Kinetics in Solid State Bonding of Superplastic Steel 一 Effect of Geometrical Factors of Surface Asperity on Contacting Modes and Bonding Mechanisms 一

机译:高压钢固态粘结动力学一效干钢对接触模式和粘接机制的几何因素效应一

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摘要

The solid state bonding of fine-grained high carbon steel with different initial void shapes (surface asperities) was carried out. The contacting modes and predominant bonding mechanisms were investigated. The interfacial contacting process was influenced by the geometrical factor: initial void shape with the surface asperity angle a0. The surface asperity angle changed the initial void shape on the bonding interface. When a0 =10 ?15 deg, the initial void shape was Lens-type. While a0 = 40 ?45 deg, it was Massif-type by the observation of cross section on the bonding interface. Lens-type contacting process was controlled by surface folding mode, which showed a high bonding rate. On the other hand, Massif-type contacting process was controlled by both surface folding and interfacial expansion modes, which inhibited the contacting rate. In spite of two modes, it was found that superplastic deformation could be the predominant bonding mechanism if the bonding conditions, temperature and pressure were appropriate. In other words, it was identified from the stress exponent n value and the activation energy Q value of each bonding mechanism that superplastic flow played a dominant role in the interfacial contacting process from a bonding ratio of 30% to 40%, under the conditions of bonding temperature T=1023 ?1053 K and bonding pressure P = 35 ?45 MPa.
机译:进行了具有不同初始空隙形状(表面粗糙)的细粒度高碳钢的固态键合。研究了接触模式和主要粘合机制。界面接触过程受几何因素的影响:初始空隙形状与表面粗糙角A0。表面粗糙度的角度改变了粘合界面上的初始空隙形状。当A0 = 10?15°时,初始空隙形状为镜片型。虽然A0 = 40?45°,但通过观察粘合界面上的横截面是块状的。镜头式接触过程由表面折叠模式控制,显示出高键合速率。另一方面,通过表面折叠和界面膨胀模式来控制块状型接触过程,这抑制了接触率。尽管有两种模式,但是如果粘合条件,温度和压力合适,则结果发现超塑性变形可以是主要的粘合机制。换句话说,从应力指数n值识别,并且在界面接触过程中,在界面接触过程中在界面接触过程中起显性作用的粘合率在条件下键合温度T = 1023〜1053 k和键合压力P = 35〜45MPa。

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