EXPERIMENTAL INVESTIGATION OF PLANTED PIN FIN IN PLATE FIN HEAT SINK FOR ELECTRONICS COOLING

摘要

In the present study, the thermal performance of plate-ellipse, plate-circular pin fin heat sink is carried out experimentally and physical impending into the flow and heat transfer characteristics is provided. The performance of heat sink is examined for different Reynolds number, fin thickness, copper and CCC base plates. The plate-circular pin fin heat sink is composed of a plate fin heat sink and some circular pins between plate fins. The purpose of this study is to examine the effects of the configurations of the elliptical, circular pin fins design. In this paper, the thermal performance of plate-circular pin fin heat sink has been compared with plate-ellipse pin fin heat sink. The results show that the plate-circular pin fin heat sink has better synthetic performance rather than the plate fin heat sink. The plate-ellipse pin fin heat sink performance is significantly increased when compare to plate-circular pin fin heat sink. The CCC base plate elliptical pin fin heat sink performance is better than copper base plate.