...
首页> 外文期刊>Journal of Sol-Gel Science and Technology >Influence of gelation step for preparing PEG-SiO2 shape-stabilized phase change materials by sol-gel method
【24h】

Influence of gelation step for preparing PEG-SiO2 shape-stabilized phase change materials by sol-gel method

机译:溶胶 - 凝胶法制备PEG-SiO2形状稳定相变材料的凝胶化步骤的影响

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

An in situ shape-stabilized phase change material (ssPCM) from polyethylene glycol (PEG) has been produced by sol-gel method. The inorganic matrix was in situ formed from tetraethyl orthosilicate (TEOS), controlling the condensation rate in a second alkaline step using NaOH. ssPCMs having a latent heat up to 113.8J/g were synthetized using a sol with a molar ratio H2O:EtOH:H2SO4:PEG1000:TEOS of 2:0.34:0.021:0.50:1 and an equivalent ratio NaOH/H2SO4 of 1.15 for promoting the gel step. The presence of high-density hydrogen bonds between silanol groups and the ether oxygen atoms of PEG and the existence of latent heat allowed to confirm that the PEG worked in two ways. It either forms the PEG-SiO2 matrix or adsorbs onto the surface of the previous polymeric matrix, losing or conserving its latent heat, respectively. The addition of NaOH allowed to change the functionality of the silicon matrix which strongly affected the water content, the thermal stability, and the amount of active PEG in the ssPCMs, leading to an optimal neutralization condition when an equivalent ratio NaOH/H2SO4 of 1.15 was used. The obtained ssPCM has an appropriate range of operative temperatures, a high latent heat in the range of common thermoregulating materials, and a proper thermal reliability.
机译:通过溶胶 - 凝胶法制造了来自聚乙二醇(PEG)的原位形状稳定的相变材料(SSPCM)。无机基质原位由四乙基异硅酸盐(TEOS)形成,使用NaOH控制第二碱性步骤中的缩合速率。合成具有高达113.8J / g的潜热的SSPCM,用溶液H 2 O:EtOH:H 2 SO 4:PEG1000:TEOS为2:0.34:0.021:0.50:1和1.15的NaOH / H 2 SO 4的等效比为1.15凝胶步骤。在硅烷醇基团和PEG的乙醚氧原子之间存在高密度氢键和潜水的存在,使得佩格以两种方式进行了处理。它要么在先前聚合物基质的表面上形成PEG-SiO 2基质,分别丢失或保存其潜热。允许添加NaOH以改变硅基矩阵的功能,该硅基矩阵强烈影响SSPCM中的含水量,热稳定性和活性PEG的量,导致1.15的等效比NaOH / H 2 SO 4的最佳中和条件用过的。所获得的SSPCM具有适当的操作温度范围,在普通的热调节材料范围内具有高潜热,以及适当的热可靠性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号