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首页> 外文期刊>Journal of Materials Engineering and Performance >Electrodeposition and Properties of Composites Consisting of Carbon Nanotubes and Copper
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Electrodeposition and Properties of Composites Consisting of Carbon Nanotubes and Copper

机译:由碳纳米管和铜组成的复合材料的电沉积和性质

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Copper–matrix–carbon nanotubes (Cu–CNTs) composite films were prepared in a Cu plating solution with multiwall carbon nanotubes (MWCNTs) using electrodeposition. The MWCNTs surface treatment method, electroplating solution system, electroplating conditions, heat treatment process and other parameters of this process are discussed. The results showed that MWCNTs purified by HCl treatment and dispersed by stearyltrimethylammonium bromide are more suitable as add-on materials for the preparation of the copper matrix composite films by electrodeposition. An appropriate heat treatment process was able to improve the structures and properties of the composite films. The final products showed that the MWCNTs were evenly distributed in the composite films and joined with the copper grains to form a mutually entangled mesh structure with excellent corrosion resistance (3.19?×?10_(?8)???M) and a hardness of 53.5?HV. All this was possible through extensive optimization of the electrodeposition and post-treatment parameters.
机译:使用电沉积在具有多壁碳纳米管(MWCNT)的Cu电镀溶液中制备铜基质 - 碳纳米管(Cu-CNT)复合膜。讨论了MWCNTS表面处理方法,电镀溶液系统,电镀条件,热处理过程和该过程的其他参数。结果表明,通过HCl处理纯化并通过硬脂基甲基溴化铵纯化的MWCNTs更适合于通过电沉积制备铜基质复合膜的加载材料。适当的热处理过程能够改善复合膜的结构和性质。最终的产品表明,MWCNT均匀地分布在复合膜中,并与铜颗粒连接,形成具有优异耐腐蚀性的相互缠结的网状结构(3.19≤x≤10_(α8)??? m)和硬度53.5?HV。通过广泛优化电沉积和后处理参数,所有这些都是可能的。

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