Optimized design of silicone pad for bended window lamination in organic light-emitting diodes

摘要

Recently, various types of displays have been developed for use in smartphones. In particular, the shape of the glass used as the cover window of a smartphone has developed from a flat shape to a vandal shape with multiple curvatures. The lamination process for bonding an OLED backplane to such a bended cover window requires a relatively high level of skill. To develop such a technique, we designed a silicone pad with sufficient adhesive strength to suit the various curvatures. In this paper, we have confirmed the results.