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首页> 外文期刊>Journal of manufacturing science and engineering: Transactions of the ASME >Additive Manufacturing With Conductive, Viscoelastic Polymer Composites: Direct-Ink-Writing of Electrolytic and Anodic Poly(Ethylene Oxide) Composites
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Additive Manufacturing With Conductive, Viscoelastic Polymer Composites: Direct-Ink-Writing of Electrolytic and Anodic Poly(Ethylene Oxide) Composites

机译:具有导电,粘弹性聚合物复合材料的添加剂制造:电解和阳极聚(环氧乙烷)复合材料的直接墨水写入

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摘要

Conductive viscoelastic polymer composites (CVPCs) consisting of conductive fillers in viscoelastic polymer matrices find numerous applications in emerging technologies such as flexible electronics, energy storage, and biochemical sensing. Additive manufacturing methods at micro- and mesoscales provide exciting opportunities toward realizing the unique capabilities of such material systems. In this paper, we study the direct-ink-writing (DIW) process of CVPCs consisting of electrically conductive additives in a poly(ethylene oxide) (PEO) matrix. We particularly focus on the deposition mechanisms of the DIW process and the influence of these mechanisms on the printed structure geometry, morphology, and functional properties. To this end, we utilized a novel practical approach of modeling the ink extrusion through the nozzles considering the non-Newtonian viscous effects while capturing the viscoelastic extensional flow (drawing) effects through the variation of the nozzle exit pressure. We concluded that inks containing higher amounts of high molecular weight (HMW) PEO exhibit drawing type deposition at high printing speeds and low inlet pressures enabling thinner, higher aspect ratio structures with ideal three-dimensional stacking. Under this deposition mechanism, the electrical conductivity of the anodic structures decreased with increasing printing speed, indicating the effect of the drawing mechanism on the printed structure morphology.
机译:由粘弹性聚合物矩阵中的导电填料组成的导电粘弹性聚合物复合材料(CVPC)在柔性电子,能量存储和生物化学传感等新兴技术中发现了许多应用。微型和媒介学的添加剂制造方法为实现这种材料系统的独特能力提供了令人兴奋的机会。在本文中,我们研究了由聚(环氧乙烷)(PEO)基质中的导电添加剂组成的CVPC的直接墨水写入(DIW)过程。我们特别关注DIW工艺的沉积机制以及这些机制对印刷结构几何形状,形态和功能性的影响。为此,我们利用一种新颖的实用方法,其通过考虑非牛顿粘性效果的喷嘴来建模墨水挤出,同时通过喷嘴出射压力的变化捕获粘弹性延伸流(图)效果。我们得出结论,含有较高量的高分子量(HMW)PEO的油墨在高印刷速度和低入口压力下表现出拉伸型沉积,并且具有较薄的,高纵横比结构,具有理想的三维堆叠。在该沉积机构下,阳极结构的电导率随着印刷速度的增加而降低,表示拉伸机制对印刷结构形态的影响。

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