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首页> 外文期刊>Journal of manufacturing science and engineering: Transactions of the ASME >Microstructure Stability of a Fine-Grained AZ31 Magnesium Alloy Processed by Constrained Groove Pressing During Isothermal Annealing
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Microstructure Stability of a Fine-Grained AZ31 Magnesium Alloy Processed by Constrained Groove Pressing During Isothermal Annealing

机译:在等温退火过程中由约束凹槽压制处理细粒AZ31镁合金的微观结构稳定性

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In this study, an AZ31 magnesium alloy plate was processed by constrained groove pressing (CGP) under three deformation cycles at temperatures from 503 to 448 K. The process resulted in a homogeneous fine grain microstructure with an average grain size of 1.8 mu m. The as-processed microstructure contained a high fraction of low-angle grain boundaries (LAGB) of subgrains and dislocation boundaries that remained in the structure due to incomplete dynamic recovery and recrystallization. The material's yield strength was found to have increased from 175 to 242 MPa and with a significant weakening of its initial basal texture. The microstructure stability of the CGP-processed material was further investigated by isothermal annealing at temperature from 473 to 623 K and for different time. Abnormal grain growth was observed at 623 K, and this was associated with an increased in nonbasal grains at the expense of basal grains. The effect of annealing temperature and time on the grain growth kinetics was interpreted by using the grain growth equation, D-n + D-0(n) = kt, and Arrhenius equation, k = k(0) exp (-(Q/RT)). The activation energy (Q) was estimated to be 27.8 kJ/mol which was significantly lower than the activation energy for lattice self-diffusion (Q(L) = 135 kJ/mol) and grain boundary diffusion (Q(gb) = 92 kJ/mol) in pure magnesium. The result shows that grain growth is rapid but average grain size still remained smaller than the as-received material, especially at the shorter annealing time.
机译:在该研究中,通过在503至448k的温度下在三个变形循环下由约束槽压(CGP)加工AZ31镁合金板。该方法导致均匀的细粒微观结构,平均晶粒尺寸为1.8μm。由于不完全的动态回收和重结晶,所处理的微结构包含封面和脱位边界的低角度晶界(LAGB)的高分数。发现材料的屈服强度从175升至242MPa增加,并且对其初始基础纹理的显着弱化。通过473至623k和不同时间的温度进一步研究CGP加工材料的微观结构稳定性。在623k下观察到异常晶粒生长,这与基部颗粒的牺牲品中的非基团晶粒中的增加有关。通过使用晶粒生长方程,DN + D-0(n)= kt,k = k(0)exp( - (q / Rt)来解释退火温度和时间对晶粒生长动力学对晶粒生长动力学的影响。 )。激活能量(Q)估计为27.8kJ / mol,其显着低于晶格自扩散的激活能量(Q(1)= 135 kJ / mol)和晶界扩散(q(gb)= 92kj / mol)在纯镁中。结果表明,谷粒生长是快速的,但平均晶粒尺寸仍然小于接收的材料,尤其是在较短的退火时间。

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