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E-strategies for aftermarket facilitation in the global semiconductor manufacturing industry

机译:全球半导体制造业售后市场促进的电子策略

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Purpose The paper presents one of the first attempts to identify and categorise the fundamental barriers currently preventing the multibillion semiconductor equipment manufacturing industry from implementing existing B2B e-trading models for its secondary market. It furthermore proposes a global e-business strategy supporting aftermarket integration with the industry's supply chain. Design/methodology/approach Because of the global nature of the industry, the research employs a multiple case-study design to explore the state-of-the-art in semiconductor excess management. The data for this analysis are obtained through a number of in-depth interviews with experts from a cross-section of the industry, and further supplemented and validated with a systematic literature review and public corporate data. Findings The results indicate that significant market imperfections still exist in the industry due to information and knowledge deficits, organisational inefficiency and IP-related concerns. The considerable levels of third-party competition to the original equipment manufacturers raise questions about the existence and efficacy of reverse logistics processes and Closed-Loop Supply Chain (CLSC) management strategies in this industry. It has been shown that a leaner semiconductor supply chain is achievable through the implementation of the proposed B2B e-marketplace, maintaining the information exchange on the surplus/obsolete equipment and parts. Originality/value These outcomes are unique for supporting the design of the first global e-marketplace for the secondary semiconductor equipment and spares. The results can, furthermore, inform the standardisation of the semiconductor aftermarket transactions, streamline knowledge exchange mechanisms amongst different industry players and improve pricing strategies. These contribute to knowledge of principles allowing the aftermarket e-trading to become a key part of the value network in high-tech manufacturing industries.
机译:目的本文提出了首次识别和分类目前防止Multibilion半导体设备制造业的基本障碍的尝试之一,从而为其二级市场实施现有的B2B电子交易模式。它还提出了一个全球电子商务战略,支持与业界供应链的售后市场融合。设计/方法/方法由于行业的全球性质,研究采用多种案例研究设计来探索半导体过剩管理的最先进。该分析的数据通过与行业横截面的专家进行了多次深入访谈,进一步补充和验证了系统文献综述和公共公司数据。结果表明,由于信息和知识赤字,组织效率低,与知识产权相关的关注,业界仍存在显着的市场缺陷。对原始设备制造商的相当大级别的第三方竞争提出了关于逆向物流流程和闭环供应链(CLSC)管理策略在该行业中的存在的问题。已经表明,通过实现所提出的B2B电子市场,可以实现更精简的半导体供应链,维护对剩余/过时设备和零件的信息交换。原创性/价值这些结果对于支持二次半导体设备和备件的第一届全球电子市场的设计是独一无二的。此外,结果可通知半导体售后事务的标准化,在不同的行业参与者之间简化知识交流机制,提高定价策略。这些有助于了解原则的知识,允许售后市场E-Trading成为高科技制造业价值网络的关键部分。

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