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Anticorrosion potential of domperidone on copper in different concentration of hydrochloric acid solution

机译:不同浓度盐酸溶液中铜的防腐电位

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摘要

The inhibition performance of domperidone on the corrosion of copper in different concentration of HCl solution has been investigated by electrochemical, weight loss, and surface analysis, and theoretical calculation methods. Results indicate that domperidone was found to be an effective inhibitor with the inhibition efficiency as high as 98.5% when the HCl concentration was 0.01M, and the corrosion rate of copper increased with the increment of HCl concentration from 0.001 to 1M. The potentiodynamic polarization results revealed that domperidone can be seen as a mixed type inhibitor when the HCl concentration was high (1 and 0.1M), while it acted as a cathodic inhibitor for copper at low HCl concentrations (0.01 and 0.001M). The potentiodynamic polarization results revealed that domperidone can be seen as mixed-type or cathodic inhibitor as the HCl concentration changes. Scanning electron microscopy studies indicated the formation of protective films of inhibitor molecule on copper surface. Besides, density functional theory-based quantum chemical calculations and molecular dynamics simulations showed the electronic structure of domperidone and its optimized adsorption configuration on copper surface, which could account for the experimental findings.
机译:通过电化学,体重减轻和表面分析,研究了DOMPERIDONE对不同浓度HCl溶液腐蚀的抑制性能,以及理论计算方法研究了。结果表明,当HCl浓度为0.01μm时,发现DOMPERIDONE是一种有效抑制剂,抑制效率高达98.5%,并且铜的腐蚀速率随HCl浓度的增量,从0.001〜1M增加。电位动力学偏振结果显示,当HCl浓度高(1和0.1M)时,Dumperidone可以被视为混合式抑制剂,而在低HCl浓度(0.01和0.01m)时,它作为铜的阴极抑制剂。电极动力学偏振结果显示,随着HCl浓度的变化,Dumperidone可以被视为混合型或阴极抑制剂。扫描电子显微镜研究表明铜表面抑制剂分子保护膜的形成。此外,基于密度的函数理论的量子化学计算和分子动力学模拟显示了Domperidone的电子结构及其在铜表面上的优化吸附配置,这可能考虑实验结果。

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