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Investigation of the creep behavior of graphene oxide nanoplatelet-reinforced adhesively bonded joints

机译:石墨烯型纳米片型粘接接头蠕变行为的研究

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摘要

In this paper, the effect of adding graphene oxide nano-platelets (GONPs) into the adhesive layer was investigated on the creep behavior of adhesively bonded joints. The neat and GONP-reinforced adhesive joints were manufactured and tested under creep loading with different stress and temperature levels. 0.1 wt% GONPs revealed the highest improvement on the adhesive joint creep behavior amongst the studied weight percentages. Furthermore, the effect of GONPs on the creep behavior of adhesive joints was more significant at higher temperatures. It was found that adding 0.1 wt% of GONPs into the adhesive layer imposed reductions of 21%, 31% and 34% in the elastic shear strains and reductions of 24%, 31% and 37% in the creep shear strains of SLJs under testing temperatures of 30, 40 and 50 degrees C, respectively. The Burgers rheological model was employed for simulating the creep behavior of the neat and GONP-reinforced adhesive joints. The Burgers model parameters were obtained as functions of testing temperature, creep shear stress and GONP weight percentage using a response surface methodology. Reasonable agreement was obtained between the modeled and experimental creep behaviors of the adhesive joints.
机译:本文研究了将氧化石墨纳米血小板(GONP)添加到粘合剂层中的粘接性粘接接头的探测。在具有不同应力和温度水平的蠕变加载下制造和测试整洁和甘醇增强粘合剂。 0.1重量%的巨粒揭示了研究的重量百分比中粘合剂蠕变行为的最高改善。此外,在较高的温度下,大量对粘合接头蠕变行为的影响更显着。发现在测试中,将0.1wt%的粘合剂层施加到粘合剂层中,在弹性剪切菌株中施加21%,31%和34%,在测试的蠕变剪切菌株中降低24%,31%和37%分别为30,40和50摄氏度的温度。使用汉堡流变模型来模拟整洁和卷积粘合剂的蠕变行为。使用响应面方法获得汉堡模型参数作为测试温度,蠕变剪切应力和收入重量百分比的功能。在粘合剂的模型和实验蠕变行为之间获得合理的协议。

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