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A study on the effect of inter-electrode gap and pulse voltage on current density in electrochemical additive manufacturing

机译:电极间隙和脉冲电压对电化学添加剂制造电流密度的影响研究

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摘要

Electrochemical Additive Manufacturing-a novel non-thermal metal additive manufacturing process offers some advantages over traditional energy beam-based layered manufacturing processes, which have several inherent limitations such as thermal damages, residual stress, and part size restrictions. In this process, the principle of localized electrochemical deposition of metals is combined with the additive manufacturing procedure to manufacture metal parts at room temperature directly from computer-aided design files. The focus of research work presented in this paper is on the modeling of the current density produced in the electrochemical deposition system based on the Fick's law of diffusion and electrode kinetics using the Butler-Volmer equation. The current densities involved in the micro-electrochemical additive manufacturing on nickel have been found to be several orders of magnitude higher than the standard electroplating studies, making it a very high overpotential deposition. The model developed in this work was used to study the effects of applied potential, pulse duty cycle, inter-electrode gap, and concentration on the current density and the transient diffusion layer thickness. The model predicted that lower inter-electrode gaps facilitated higher current density leading to faster deposition rates. The pulse voltage was found to produce higher current densities during the pulse-on time. The modeled current density values were validated with experimental results using the in-house-built electrochemical additive manufacturing setup.
机译:电化学添加剂制造 - 一种新型的非热金属添加剂制造工艺提供了一些优于传统的能量束的层状制造工艺的一些优点,其具有诸如热损坏,残余应力和部分尺寸限制的若干内在局限性。在该过程中,金属的局部电化学沉积原理与添加剂制造过程结合,以直接从计算机辅助设计文件在室温下制造金属部件。本文提出的研究工作的重点是基于Fick的扩散和电极动力学的电化学沉积系统中产生的电流密度的模型,使用Butler-Volmer方程。已经发现镍上微电化学添加剂制造的目前的密度是比标准电镀研究高的几个数量级,使其成为非常高的过电位沉积。该工作中开发的模型用于研究应用的电位,脉冲占空比,电极间隙和浓度对电流密度和瞬态扩散层厚度的影响。该模型预测,较低的电极间隙便于更高的电流密度,导致更快的沉积速率。发现脉冲电压在脉冲接通时间内产生更高的电流密度。使用内置的电化学添加剂制造设置,用实验结果验证建模电流密度值。

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