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首页> 外文期刊>Jorunal of computational and theoretical transport >Microscale Thermal Energy Transfer Over a Combined System of Thin Films: Analytical Approach
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Microscale Thermal Energy Transfer Over a Combined System of Thin Films: Analytical Approach

机译:微观的热能转移在薄膜的组合系统上:分析方法

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An analytical approach for the solution of the equation for phonon transport is presented for the combination thin films system. The transient phonon radiative transport model is considered and the combination of the silicon-diamond-silicon films is accommodated in the analysis. The multi-film system is thermally disturbed from the edges through introducing temperature difference across the combined films. Equivalent equilibrium temperature is considered quantifying the distribution of the phonon intensity in the films. Equivalent equilibrium temperature obtained from the analytical approach is compared with that predicted from the numerical solution. It is found that numerical predictions of equivalent equilibrium temperature agree well with those obtained from the analytical approach. The boundary scattering of phonons at the film edges causes equivalent equilibrium temperature jump at film edges, which becomes apparent in the early heating periods. Phonon scattering in the combined films causes sharp decay of temperature in the films, which is more pronounced in the silicon film than that of the diamond.
机译:提出了一种用于组合薄膜系统的声子输送方程的解析方法。考虑瞬态声子辐射传输模型,并在分析中容纳硅金刚硅膜的​​组合。通过在组合膜上引入温度差,多胶片系统从边缘热干扰。当量平衡温度被认为是量化薄膜中声子强度的分布。将从分析方法获得的等效平衡温度与来自数值溶液预测的预测相比。发现当量平衡温度的数值预测与从分析方法获得的那些相同。在薄膜边缘处的声子的边界散射导致在薄膜边缘处的等效平衡温度跳跃,这在早期加热时段变得明显。在组合膜中的声子散射导致薄膜中的温度衰减,这在硅膜上比金刚石更明显。

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