STUDY ON CONTINUOUS COLD-PRESSING TECHNOLOGY OF ENGINEERED WOOD FLOORING WITH EPI ADHESIVE

摘要

The effects of process parameters (adhesive spread, press time, and applied pressure) on the gluing performance of engineered wood flooring bonded with emulsion-polymer-isocyanate (EPI) adhesive were studied. The results showed (shear strength and aging test) that the major factors were adhesive spread and press time. The optimized parameters for best gluing performance of engineered wood flooring were 160 gm(2),14 s, and 60 s for adhesive spread, heat time, and press time, respectively, within certain ranges.