Effects of brazing temperature and holding time on wettability of brazing diamond and brazing interface analysis

摘要

This paper aims to study the effects of different brazing temperatures and holding time on the exposing height of the brazing diamond and wetting angle of the solder, and to analyze the morphology and composition of the reaction products at the interface between the diamond and the solder. Using the Ni-Cr-B-Si composite solder, the orderly arrangement method, the flame spraying process, and the remelting technology-based vacuum carbon tube furnace, the sample block with single layer ordered diamond is prepared. The results show that with the increasing of brazing temperature, the exposing height of the diamond, and the wetting angle of the solder decrease, and with the increasing of holding time, the exposing height of the diamond increases, and the wetting angle of the solder decreases. In addition, the fine acicular Cr-C compounds are formed at the brazing interface between diamond and solder, which prevents the increasing of wetting capacity of solder. The study of the effects of brazing temperature and holding time on the brazing quality, and the analysis of the morphology and composition of the products in the brazing interface, provide important technical and theoretical support for the better production of brazing diamond tools.