>With regard to Secondary Ion Mass Spectroscopy (SIMS) measurement of atmospheric gas elements, a problem occ'/> An effect of residual gas component on detected secondary ions during TOF‐SIMS depth profiling and a method to estimate contained component
首页> 外文期刊>Surface and Interface Analysis: SIA: An International Journal Devoted to the Development and Application of Techniques for the Analysis of Surfaces, Interfaces and Thin Films >An effect of residual gas component on detected secondary ions during TOF‐SIMS depth profiling and a method to estimate contained component
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An effect of residual gas component on detected secondary ions during TOF‐SIMS depth profiling and a method to estimate contained component

机译:在TOF-SIMS深度分析中检测次级离子对检测到的二次离子的影响及估算含有组分的方法

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>With regard to Secondary Ion Mass Spectroscopy (SIMS) measurement of atmospheric gas elements, a problem occurs that the detected signal includes background components caused by residual gas along with contained components. Relating to this issue, an available method to quantify the contained components by separating the background ones had been established for Dynamic SIMS. Time‐of‐Flight SIMS with sputtering ion gun has also applied for depth profiling as well as Dynamic SIMS. However, few studies have attempted to investigate the secondary ion behavior of the atmospheric gas elements for depth profiling by Time‐of‐flight SIMS, especially for low concentration levels. In this study, experimental examinations of the secondary ions of the atmospheric gas elements, such as oxygen, hydrogen, and carbon in the silicon substrate, has been conducted in various analytical conditions of TOF‐SIMS depth profiling mode. Under the analytical conditions of our study, it has been proved that the background intensity of these elements was correlated to the sputtering rate. For the analysis of Floating Zone Silicon substrate, the oxygen intensity of the background component was proportional to the inverse number of the sputtering rate. Based on these facts, the total detected intensity of the atmospheric gas elements was able to be separated into the contained components and background ones by changing the sputtering rate during TOF‐SIMS measurement. An experimental result has shown that the contained oxygen concentration in the Czochralsk Silicon substrate estimated by the “TOF‐SIMS Raster Change Method” has successfully agreed with the result by the Dynamic SIMS.
机译: >关于次要离子质谱(SIMS)测量的大气气体元件,发生问题:检测信号包括由残余气体以及包含的部件引起的背景部件。与此问题有关,通过分离用于动态SIMS来计算包含的组件的可用方法。具有溅射离子枪的飞行时间模拟器也涂覆了深度分析以及动态模拟器。然而,很少有研究试图研究大气气体元件的二次离子行为,用于通过飞行时间SIMS进行深度分析,特别是对于低浓度水平。在该研究中,在TOF-SIMS深度分析模式的各种分析条件下,在硅衬底中进行了大气气体元件的二次离子,例如氧气,氢气和碳的实验检查。在我们研究的分析条件下,已经证明了这些元素的背景强度与溅射率相关。对于浮区硅衬底的分析,背景部件的氧强度与溅射率的倒数成比例。基于这些事实,通过改变TOF-SIMS测量期间,能够通过改变溅射速率分离到包含的部件和背景中的大气气体元件的总检测强度。实验结果表明,由“TOF-SIMS光栅改变方法”估计的Czochralsk硅衬底中的含氧浓度成功地同意动态SIMS的结果。

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