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Why electronics designers don't use thermal simulation

机译:为什么电子设计师不使用热仿真

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摘要

The industry is all too familiar with the challenges that come from putting more and more powerful electronics into smaller and smaller packaging, and the technical issues that can present. More "smart" means more computing which means more heat, greater thermo-structural challenges, and greater fatigue or expansion issues that can affect product performance and quality. This doesn't just affect small equipment. One of Hexagon's customers, Analog Way, had to deal with 2Kw of heat generated from driving the highest resolution video display in the history of Times Square - that's as much as an electric fire.
机译:这行业都太熟悉了将越来越强大的电子设备放入更小和更小的包装中的挑战,以及可能存在的技术问题。 更多“智能”意味着更多的计算,这意味着更多的热量,更高的热结构挑战,以及可能影响产品性能和质量的更大的疲劳或扩展问题。 这不仅影响小型设备。 六角客户的客户,模拟方式必须处理2KW的热量,从驾驶时代广场的历史上推动最高分辨率的视频显示器 - 这与电火火一样多。

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