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首页> 外文期刊>Solar Energy Materials and Solar Cells: An International Journal Devoted to Photovoltaic, Photothermal, and Photochemical Solar Energy Conversion >Large process-dependent variations in band alignment and interface band gaps of Cu2ZnSnS4/CdS solar cells
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Large process-dependent variations in band alignment and interface band gaps of Cu2ZnSnS4/CdS solar cells

机译:CU2ZNS4 / CDS太阳能电池的带对准和界面带间隙的大处理依赖性变化

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Electron hole recombination at the Cu2ZnSnS4/CdS interface is believed to play a major role in limiting the efficiency of Cu2ZnSnS4 solar cells. In this work, we experimentally determine detailed Cu2ZnSnS4/CdS interface band diagrams as a function of process conditions, and correlate them to chemical processes occurring during interface formation and subsequent post-annealing. The newly devised experimental method involves a combination of photoemission spectroscopy and spectroscopic ellipsometry. Our measurements reveal that, under most process conditions, the band gaps of both Cu2ZnSnS4 and CdS decrease by several hundred meV near the interface. Furthermore, interface band bending and conduction band offsets are highly process-dependent and roughly correlated to the amount of chemical interdiffusion. The interface electronic properties are found to be unfavorable under all process conditions studied in this work, either due to a cliff-like conduction band offset, or to substantial band gap narrowing in Cu2ZnSnS4, or to both effects. According to the present study, the least harmful process conditions for the interface electronic properties are a low CdS deposition temperature without post-annealing. Even in such a case, a minimum open circuit voltage loss of 230 mV is expected due to interface or near-interface recombination.
机译:CU2ZNSNS4 / CD界面处的电子空穴重组被认为在限制Cu2ZNSN4太阳能电池的效率时发挥重要作用。在这项工作中,我们通过实验确定详细的Cu2zNSN4 / CDS接口界面频带图作为过程条件的函数,并将它们与界面形成期间发生的化学过程和随后的退火后相关联。新设计的实验方法涉及光曝光光谱和光谱椭圆形测量的组合。我们的测量表明,在大多数过程条件下,CU2ZNSN4和CDS的带间隙在接口附近的数百MEV减小了数百MEV。此外,界面带弯曲和导通带偏移是高处理依赖性的并且与化学相互作用的量大致相关。发现界面电子特性在这项工作中研究的所有工艺条件下,由于悬崖状导通带偏移,或者在CU2ZNSNS4中或两者效应中缩小的基本带隙。根据本研究,界面电子特性的最小有害工艺条件是低CDS沉积温度而不发生退火。即使在这种情况下,由于接口或接近接口重组,预期最小开路电压损耗为230 mV。

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