Electrodeposition of CoNiMnP Thick Films for Micromachined Magnetic Device Applications

摘要

CoNiMnP permanent magnetic alloys were electrodeposited on copper and brass substrates from a bath containing 26 g/L CoCl 2 ·6H2 O, 24 g/L NiCl 2 ·6H2 O, 3.6 g/L MnSO4 , 4.6 g/L NaH2 PO2 ·H2 O as precursors and H3 BO3 , NaCl, saccharin, sodium lauryl sulphate and cerium(III) sulphate as additives. Influence of the presence of external magnetic field (2 T) was investigated using vibrating sample magnetometry and SEM/ EDS microscopy.