Creating Conductive Copper-Silver Bimetallic Nanostructured Coatings Using a High Temperature Reducing Jet Aerosol Reactor

摘要

We report production of bimetallic nanostructured copper-silver coatings by in situ deposition and sintering of metal nanopar-ticles produced as an aerosol. The metal nanoparticles themselves have potential applications in printed electronics, catalysis, antibacterial coatings, and heat transfer fluids. In many applications, nanoparticles are dispersed in an ink, which is then printed or coated onto a substrate and converted into a nanostructured thin film. Direct deposition from the aerosol allows us to produce nanostructured thin films without first dispersing the particles in a solvent. The high temperature reducing jet process allows formation of these metal nanoparticles from low-cost metal salt precursors in the gas phase. In this method, a fuel-rich hydrogen flame provides a low-cost source of energy to drive nanoparticle formation in a reducing environment. The aqueous precursor solution is delivered into the hot combustion product gases within a converging-diverging nozzle. The high-speed gas flow atomizes the precursor and provides exceptionally rapid mixing of the precursor with the hot gases. Here, particles are formed, then immediately quenched and deposited on a glass substrate. The effect of the silver content of the mixed copper-silver films on their electrical conductivity was studied systematically, revealing an abrupt transition from low conductivity to high conductivity between 30 wt.% and 40 wt.% silver.